Invention Grant
- Patent Title: Hall sensor packages
-
Application No.: US16842567Application Date: 2020-04-07
-
Publication No.: US11322433B2Publication Date: 2022-05-03
- Inventor: Enis Tuncer , Alejandro Hernandez-Luna
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/498 ; H01L43/06

Abstract:
In some examples, a package comprises first and second terminals and a conductive pathway coupling the first and second terminals. The conductive pathway is configured to generate a magnetic field. The package comprises a conductive member aligned with and coupled to the conductive pathway. The conductive pathway and the conductive member have a common shape. The package also comprises an insulative layer coupled to the conductive member and a die coupled to the insulative layer and having a circuit configured to measure the magnetic field. The circuit faces the conductive pathway.
Public/Granted literature
- US20210313258A1 HALL SENSOR PACKAGES Public/Granted day:2021-10-07
Information query
IPC分类: