Invention Grant
- Patent Title: Semiconductor package structures, semiconductor device packages and methods of manufacturing the same
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Application No.: US16681500Application Date: 2019-11-12
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Publication No.: US11322471B2Publication Date: 2022-05-03
- Inventor: Wen Hung Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor package structure includes a first substrate, a second substrate, a first redistribution layer, and a first reconnection layer. The first substrate may have a first surface. The second substrate can be spaced apart from the first substrate with a gap and may have a second surface. The first redistribution layer can be disposed between the first redistribution layer and the gap. The first substrate can be electrically connected to the second substrate via the first reconnection layer.
Public/Granted literature
- US20210143119A1 SEMICONDUCTOR PACKAGE STRUCTURES, SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-05-13
Information query
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