Invention Grant
- Patent Title: Multi-stage trans-impedance amplifier (TIA) for an ultrasound device
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Application No.: US16011715Application Date: 2018-06-19
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Publication No.: US11324484B2Publication Date: 2022-05-10
- Inventor: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
- Applicant: BFLY Operations, Inc.
- Applicant Address: US CT Guilford
- Assignee: BFLY Operations, Inc.
- Current Assignee: BFLY Operations, Inc.
- Current Assignee Address: US CT Guilford
- Agency: Osha Bergman Watanabe & Burton LLP
- Main IPC: B06B1/06
- IPC: B06B1/06 ; A61B8/08 ; A61B8/00 ; H03F3/50 ; H03F3/45

Abstract:
An ultrasound circuit comprising a multi-stage trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA may include multiple stages, at least two of which operate with different supply voltages. The TIA may be followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
Public/Granted literature
- US20180360426A1 MULTI-STAGE TRANS-IMPEDANCE AMPLIFIER (TIA) FOR AN ULTRASOUND DEVICE Public/Granted day:2018-12-20
Information query
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