公开(公告)号：US11324484B2

公开(公告)日：2022-05-10

申请号：US16011715

申请日：2018-06-19

Applicant: BFLY Operations, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: B06B1/06 ,  A61B8/08 ,  A61B8/00 ,  H03F3/50 ,  H03F3/45

Abstract: An ultrasound circuit comprising a multi-stage trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA may include multiple stages, at least two of which operate with different supply voltages. The TIA may be followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.

公开(公告)号：US11545946B2

公开(公告)日：2023-01-03

申请号：US17200675

申请日：2021-03-12

Applicant: BFLY Operations, Inc.

Inventor： Amandeep Singh ,  Kailiang Chen ,  Tyler S. Ralston

IPC: H03F3/45 ,  H03M1/12 ,  B06B1/02 ,  G01S15/89 ,  G01N29/44 ,  G01S7/523 ,  G01H17/00 ,  G01S7/526 ,  G01N29/36 ,  G01N29/24 ,  H03F3/30 ,  G01S7/52

Abstract: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.