Invention Grant
- Patent Title: Fluidic dies
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Application No.: US16640563Application Date: 2017-10-19
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Publication No.: US11325385B2Publication Date: 2022-05-10
- Inventor: Jacob Lum , Jeremy Sells , Si-lam Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2017/057394 WO 20171019
- International Announcement: WO2019/078868 WO 20190425
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/175 ; B41J2/14 ; B41J2/045

Abstract:
A fluidic die may include a fluid channel layer defining a number of fluid channels therein, a slot layer disposed on a side of the fluid channel layer, and a first fluid slot and a second fluid slot defined in the slot layer. At least one of the fluid channels fluidically couples the first fluid slot to the second fluid slot. The first fluid slot and the second fluid slot are defined in the slot layer along a length of the fluidic die.
Public/Granted literature
- US20200238708A1 FLUIDIC DIES Public/Granted day:2020-07-30
Information query
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