Invention Grant
- Patent Title: Substrate processing apparatus
-
Application No.: US16214731Application Date: 2018-12-10
-
Publication No.: US11328910B2Publication Date: 2022-05-10
- Inventor: Eiichi Sugawara
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JP2011-079859 20110331
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/68 ; H01L21/687 ; H01L21/673 ; H01L21/677

Abstract:
Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a vacuum processing chamber connected with the transportation chamber through a load lock chamber; a substrate placing table installed in the vacuum processing chamber and having a body part and a surface part that is attachable to/detachable from the body part; a storage unit installed in the load lock chamber or the transportation chamber and configured to receive the surface part; and a transportation mechanism configured to transport the substrate from the transportation chamber to the vacuum processing chamber through the load lock chamber and transport the surface part between the storage unit and the body part of the vacuum processing chamber.
Public/Granted literature
- US20190109031A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-04-11
Information query