Invention Grant
- Patent Title: Solid state imaging element and electronic device
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Application No.: US16563582Application Date: 2019-09-06
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Publication No.: US11329080B2Publication Date: 2022-05-10
- Inventor: Sozo Yokogawa
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2014-120205 20140611
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/028 ; H01L31/0376

Abstract:
The present disclosure relates to a solid state imaging element and an electronic device that make it possible to improve sensitivity to light on a long wavelength side. A solid state imaging element according to a first aspect of the present disclosure has a solid state imaging element in which a large number of pixels are arranged vertically and horizontally, the solid state imaging element includes a periodic concave-convex pattern on a light receiving surface and an opposite surface to the light receiving surface of a light absorbing layer as a light detecting element. The present disclosure can be applied to, for example, a CMOS and the like installed in a sensor that needs a high sensitivity to light belonging to a region on the long wavelength side, such as light in the infrared region.
Public/Granted literature
- US20200006407A1 SOLID STATE IMAGING ELEMENT AND ELECTRONIC DEVICE Public/Granted day:2020-01-02
Information query
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