The present disclosure describes aspects of a conductive receptacle collar for desense mitigation. In aspects, an apparatus comprises a printed circuit board assembly (PCBA) that includes an integrated circuit with signal lines for a wired data interface. The apparatus also includes a coupling component with a receptacle for the wired data interface and an enclosure in which the PCBA is mounted. The enclosure has an opening through which the receptacle for the wired data interface is exposed. A conductive collar is disposed between an exterior surface of the receptacle and an interior surface of this opening. The conductive collar contacts the receptacle's exterior surface and the interior surface of the opening to electrically couple these respective surfaces. By so doing, the conductive collar improves grounding of the receptacle to the enclosure, which may mitigate the desense of the apparatus's wireless receivers caused by operation of the wired data interface.