Invention Grant
- Patent Title: Stacked structure and method for manufacturing the same
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Application No.: US16670493Application Date: 2019-10-31
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Publication No.: US11332363B2Publication Date: 2022-05-17
- Inventor: Chieh-An Yeh , Tai-Hung Kuo
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00
Abstract:
A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 μm to about 150 μm, and a burr length on a surface of the metal layer is about 0.8 μm to about 7 μm.
Public/Granted literature
- US20210130166A1 STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-05-06
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