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公开(公告)号：US11332363B2
公开(公告)日：2022-05-17
申请号：US16670493
申请日：2019-10-31
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chieh-An Yeh , Tai-Hung Kuo
Abstract: A stacked structure includes a polymer layer and a metal layer. The metal layer is disposed on the polymer layer. A burr length on a surface of the polymer layer is about 0.8 μm to about 150 μm, and a burr length on a surface of the metal layer is about 0.8 μm to about 7 μm.
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