Invention Grant
- Patent Title: Resin for use as a tie layer in multilayer structure having polyethylene terephthalate
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Application No.: US17041688Application Date: 2018-03-29
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Publication No.: US11332602B2Publication Date: 2022-05-17
- Inventor: Andong Liu , Yunlong Guo , Yong Zheng , Hongyu Chen , Brian Walther , Yi Zhang
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/CN2018/081026 WO 20180329
- International Announcement: WO2019/183870 WO 20191003
- Main IPC: C08L23/08
- IPC: C08L23/08 ; B32B27/08 ; B32B27/30 ; B32B27/32 ; B32B27/36

Abstract:
The disclosure relates to a tie resin formulation with excellent adhesion to polyethylene terephthalate (PET). The resin includes (A) an ethylene acrylate copolymer formed from ethylene and alkyl acrylate, where the ethylene acrylate copolymer has an acrylate content of 10 to 30 weight percent and an ethylene content of 90 to 70 weight percent based on the total weight of the ethylene acrylate copolymer and the acrylate content and (B) a transesterification catalyst; where the resin includes: 30 to 99.999 weight percent of the ethylene acrylate copolymer based on the total weight of the resin; 0.001 to 10 weight percent of the transesterification catalyst based on the total weight of the resin; and (C) 0 to 69.999 of a non-polar polyolefin based on the total weight of the resin.
Public/Granted literature
- US20210009795A1 RESIN FOR USE AS A TIE LAYER IN MULTILAYER STRUCTURE HAVING POLYETHYLENE TEREPHTHALATE Public/Granted day:2021-01-14
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