- Patent Title: Integrated assemblies and methods of forming integrated assemblies
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Application No.: US16952774Application Date: 2020-11-19
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Publication No.: US11335775B2Publication Date: 2022-05-17
- Inventor: Srinivas Pulugurtha , Jaydip Guha , Scott E. Sills , Yi Fang Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L27/06 ; H01L27/108 ; H01L29/24 ; H01L21/8234 ; H01L27/11502

Abstract:
Some embodiments include a transistor having an active region containing semiconductor material. The semiconductor material includes at least one element selected from Group 13 of the periodic table in combination with at least one element selected from Group 16 of the periodic table. The active region has a first region, a third region offset from the first region, and a second region between the first and third regions. A gating structure is operatively adjacent to the second region. A first carrier-concentration-gradient is within the first region, and a second carrier-concentration-gradient is within the third region. Some embodiments include methods of forming integrated assemblies.
Public/Granted literature
- US20220069082A1 Integrated Assemblies and Methods of Forming Integrated Assemblies Public/Granted day:2022-03-03
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