An irradiation assembly is provided, which is configured to heat and cure a package piece having a first region and a second region, the first region having a first adhesive material therein and the second region having a second adhesive material therein different from the first adhesive material, the irradiation assembly comprising: a light source assembly, configured to emit a first light heating the first adhesive material and to emit a second light curing the second adhesive material; and the package piece is an assembly configured to encapsulate electronic components accommodated therein, the first region is provided with the electronic components and is filled up with the first adhesive material encapsulating the electronic components, and the second region is arranged at periphery of the first region and is filled with the second adhesive material surrounding the first adhesive material.