Invention Grant
- Patent Title: Device with 3D inductor and magnetic core in substrate
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Application No.: US16986595Application Date: 2020-08-06
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Publication No.: US11336251B2Publication Date: 2022-05-17
- Inventor: Je-Hsiung Lan , Jonghae Kim , Ranadeep Dutta
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe P.C.
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H3/08 ; H03H7/46 ; H01F3/00 ; H01L23/64 ; H01L23/66 ; H01L23/538
Abstract:
Disclosed are devices and methods for fabricating devices. A device can include a passive portion having at least one metal insulator metal (MIM) capacitor and at least one 2-dimensional (2D) inductor. The device further includes a substrate and the passive portion is formed on the substrate. A magnetic core is embedded in the substrate. A 3-dimensional (3D) inductor is also included having windings formed at least in part in the substrate and at least a portion of the windings being formed around the magnetic core.
Public/Granted literature
- US20210099149A1 DEVICE WITH 3D INDUCTOR AND MAGNETIC CORE IN SUBSTRATE Public/Granted day:2021-04-01
Information query
