Invention Grant
- Patent Title: Manufacturing method of housing
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Application No.: US16867904Application Date: 2020-05-06
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Publication No.: US11337324B2Publication Date: 2022-05-17
- Inventor: Shih-Wei Chiou , Yang-Po Chiu , Ying-Ta Tseng
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: McClure, Qualey & Rodack
- Priority: TW108118155 20190524
- Main IPC: B23P25/00
- IPC: B23P25/00 ; H05K5/02 ; H05K5/00

Abstract:
A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.
Public/Granted literature
- US20200375050A1 MANUFACTURING METHOD OF HOUSING Public/Granted day:2020-11-26
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