公开(公告)号：US11337324B2

公开(公告)日：2022-05-17

申请号：US16867904

申请日：2020-05-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Shih-Wei Chiou ,  Yang-Po Chiu ,  Ying-Ta Tseng

IPC: B23P25/00 ,  H05K5/02 ,  H05K5/00

Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.

公开(公告)号：US20200375050A1

公开(公告)日：2020-11-26

申请号：US16867904

申请日：2020-05-06

Applicant: ASUSTeK COMPUTER INC.

Inventor： Shih-Wei Chiou ,  Yang-Po Chiu ,  Ying-Ta Tseng

IPC: H05K5/02 ,  H05K5/00

Abstract: A manufacturing method of a housing includes the following steps: an object providing step, a shaping step, a cooling step, a tempering step and a stamping step. In the object providing step, a semi-finished object is provided. In the shaping step, the semi-finished object is heat shaped to form a plate. In the cooling step, the plate after heat shaping is cooled. In the tempering step, the plate after cooling is tempered at a low-temperature. In the stamping step, the plate after tempering at the low-temperature is stamped at a normal temperature to form a housing.