Invention Grant
- Patent Title: Substrate processing device having connection plates, substrate processing method
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Application No.: US17039874Application Date: 2020-09-30
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Publication No.: US11339476B2Publication Date: 2022-05-24
- Inventor: Naoto Tsuji , Ippei Yanagisawa , Miho Shimotori , Makoto Igarashi
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/458 ; C23C16/505 ; C23C16/455 ; C23C16/54
Abstract:
Examples of a substrate processing device include an annular distribution ring, a plurality of connection plates continued to the distribution ring and having non-uniform impedances, a shower plate electrically connected to the plurality of connection plates, and a stage provided below the shower plate so as to face the shower plate.
Public/Granted literature
- US20210102289A1 SUBSTRATE PROCESSING DEVICE HAVING CONNECTION PLATES, SUBSTRATE PROCESSING METHOD Public/Granted day:2021-04-08
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