- 专利标题： Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
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申请号： US16926757申请日： 2020-07-12
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公开(公告)号： US11340284B2公开(公告)日： 2022-05-24
- 发明人: Kristiaan Van Rossen , Christophe Wouters
- 申请人： KLA Corporation
- 申请人地址： US CA Milpitas
- 专利权人： KLA Corporation
- 当前专利权人： KLA Corporation
- 当前专利权人地址： US CA Milpitas
- 代理机构： Hodgson Russ LLP
- 主分类号： G01R1/04
- IPC分类号： G01R1/04 ; G01R31/265 ; H01L21/66 ; H01L21/67
摘要：
A first light source is directed at an outer surface of a workpiece in an inspection module. The light from the first light source that is reflected from the outer surface of the workpiece is directed to the camera via a first pathway. The light from the first light source transmitted through the workpiece is directed to the camera via a second pathway. A second light source is directed at the outer surface of the workpiece 180° from that of the first light source. The light from the second light source that is reflected from the outer surface of the workpiece is directed to the camera via the second pathway. The light from the second light source transmitted through the workpiece is directed to the camera via the first pathway.
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