Invention Grant
- Patent Title: Substrate structures, and methods for forming the same and semiconductor package structures
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Application No.: US16899517Application Date: 2020-06-11
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Publication No.: US11342272B2Publication Date: 2022-05-24
- Inventor: Wu Chou Hsu , Min-Yao Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/538 ; H01L23/31 ; H01L23/00 ; H01L21/48
Abstract:
A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.
Public/Granted literature
- US20210391271A1 SUBSTRATE STRUCTURES, AND METHODS FOR FORMING THE SAME AND SEMICONDUCTOR PACKAGE STRUCTURES Public/Granted day:2021-12-16
Information query
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