Invention Grant
- Patent Title: Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same
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Application No.: US17291533Application Date: 2019-11-06
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Publication No.: US11345784B2Publication Date: 2022-05-31
- Inventor: Kyosuke Michigami , Tomoaki Sawada , Tomohiro Fukao , Takatoshi Abe , Andy Behr
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2019/043422 WO 20191106
- International Announcement: WO2020/095928 WO 20200514
- Main IPC: C08G83/00
- IPC: C08G83/00 ; C08G59/40 ; C08G59/42 ; H05K1/02 ; H05K1/03 ; H05K3/02 ; H05K3/46 ; H05K3/30
Abstract:
One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).
Public/Granted literature
Information query
