Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US16281801Application Date: 2019-02-21
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Publication No.: US11348722B2Publication Date: 2022-05-31
- Inventor: Jae Hun Kim , Jin Uk Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0113925 20180921
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/28 ; H01F41/04 ; H01F41/12 ; H01F27/32

Abstract:
A coil component includes a body; an internal insulating layer buried in the body; insulating walls disposed on the internal insulating layer, and including openings each having a planar coil shape having at least one turn; coil patterns including first conductive layers disposed in the openings, and second conductive layers disposed between the first conductive layers and internal surfaces of the openings, and each having a first surface in contact with the internal insulating layer and a second surface opposing the first surface; and a recessed portion formed on the second surface of each of the coil patterns and exposing at least portions of the openings of the internal walls.
Public/Granted literature
- US20200098509A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-03-26
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