Invention Grant
- Patent Title: Semiconductor package, electronic apparatus and method of manufacturing the semiconductor package
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Application No.: US16925982Application Date: 2020-07-10
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Publication No.: US11348807B2Publication Date: 2022-05-31
- Inventor: Junghoon Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2020-0000463 20200102
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/538 ; H01L25/18 ; H01L25/00 ; H01L21/683 ; H01L23/498

Abstract:
A semiconductor package includes an interposer having a separation layer on a rear surface of which a plurality of first recesses is arranged. A plurality of wiring structures is stacked on the separation layer alternately with a plurality of insulation interlayers. A plurality of semiconductor devices is arranged, side by side, on the interposer side and connected to a plurality of the wiring structures. A plurality of contact terminals on the rear surface of the separation layer is connected to the plurality of the wiring structures through the separation layer. A flatness deterioration of the interposer is minimized and the contact surface between the interposer and under fill resin is enlarged.
Public/Granted literature
- US20210210360A1 SEMICONDUCTOR PACKAGE, ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE Public/Granted day:2021-07-08
Information query
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