Invention Grant
- Patent Title: Correcting component failures in ion implant semiconductor manufacturing tool
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Application No.: US16264034Application Date: 2019-01-31
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Publication No.: US11348813B2Publication Date: 2022-05-31
- Inventor: Tianqing Liao , Sima Didari , Harikrishnan Rajagopal
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G05B23/02 ; G06N20/00 ; H01J37/317

Abstract:
Methods, systems, and non-transitory computer readable medium are provided for correcting component failures in ion implant semiconductor manufacturing tool. A method includes receiving, from sensors associated with an ion implant tool, current sensor data corresponding to features; performing feature analysis to generate additional features for the current sensor data; providing the additional features as input to a trained machine learning model; obtaining one or more outputs from the trained machine learning model, where the one or more outputs are indicative of a level of confidence of a predicted window; predicting, based on the level of confidence of the predicted window, whether one or more components of the ion implant tool are within a pre-failure window; and responsive to predicting that the one or more components are within the pre-failure window, performing a corrective action associated with the ion implant tool.
Public/Granted literature
- US20200251360A1 CORRECTING COMPONENT FAILURES IN ION IMPLANT SEMICONDUCTOR MANUFACTURING TOOL Public/Granted day:2020-08-06
Information query
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