Invention Grant
- Patent Title: Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture
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Application No.: US16902390Application Date: 2020-06-16
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Publication No.: US11348857B2Publication Date: 2022-05-31
- Inventor: Xiaopeng Qu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/31 ; H01L23/373 ; H01L23/538 ; H01L21/50
Abstract:
A microelectronic device package may include one or more semiconductor dice coupled to a substrate. The microelectronic device package may further include a lid coupled to the substrate, the lid defining a volume over and around the one or more semiconductor die. The microelectronic device package may further include a thermally conductive dielectric filler material substantially filling the volume defined around the semiconductor die.
Public/Granted literature
- US20210391235A1 LIDDED MICROELECTRONIC DEVICE PACKAGES AND RELATED SYSTEMS, APPARATUS, AND METHODS OF MANUFACTURE Public/Granted day:2021-12-16
Information query
IPC分类:
