- Patent Title: Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same
-
Application No.: US16885546Application Date: 2020-05-28
-
Publication No.: US11348864B2Publication Date: 2022-05-31
- Inventor: Seokhyun Lee , Gwangjae Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0130111 20191018
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
Disclosed are redistribution substrates and semiconductor packages including the same. For example, a redistribution substrate including a dielectric pattern, and a first redistribution pattern in the dielectric pattern is provided. The first redistribution pattern may include: a first via part having a first via seed pattern and a first via conductive pattern on the first via seed pattern, and a first wiring part having a first wiring seed pattern and a first wiring conductive pattern, the first wiring part being disposed on the first via part and having a horizontal width that is different from a horizontal width of the first via part. Additionally, the first wiring seed pattern may cover a bottom surface and a sidewall surface of the first wiring conductive pattern, and the first via conductive pattern is directly connected to the first wiring conductive pattern.
Public/Granted literature
- US20210118788A1 REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2021-04-22
Information query
IPC分类: