Invention Grant
- Patent Title: Semiconductor package structure and method for manufacturing the same
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Application No.: US16732154Application Date: 2019-12-31
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Publication No.: US11348885B2Publication Date: 2022-05-31
- Inventor: Cheng-Yuan Kung , Hung-Yi Lin
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/498 ; H01L25/16 ; H01L23/00 ; H01L25/00 ; H01L23/552 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.
Public/Granted literature
- US20210202409A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-07-01
Information query
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