- 专利标题: Connection structure and fabrication method thereof, array substrate and fabrication method thereof
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申请号: US16638196申请日: 2019-05-29
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公开(公告)号: US11348952B2公开(公告)日: 2022-05-31
- 发明人: Zhen Zhang , Pengyu Liao
- 申请人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- 申请人地址: CN Chengdu; CN Beijing
- 专利权人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Chengdu; CN Beijing
- 代理机构: Dilworth & Barrese, LLP.
- 代理商 Michael J. Musella, Esq.
- 优先权: CN201810554032.4 20180531
- 国际申请: PCT/CN2019/089096 WO 20190529
- 国际公布: WO2019/228421 WO 20191205
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/31 ; G06F1/16 ; H01L27/32 ; H01L21/311 ; H01L51/00
摘要:
Embodiments of the present provide a connection structure and a manufacturing thereof, an array substrate and a manufacturing method thereof, the manufacturing method of the connection structure includes: forming a first insulating layer on a base substrate forming a mask layer having a first opening on a side of the first insulating layer away from the base substrate; forming a second insulating layer op a side of the mask layer away-from the first insulating layer; forming a second opening exposing the first opening in the second insulating layer by one patterning process, and forming a third opening in the first insulating layer.
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