Connection structure and fabrication method thereof, array substrate and fabrication method thereof
摘要:
Embodiments of the present provide a connection structure and a manufacturing thereof, an array substrate and a manufacturing method thereof, the manufacturing method of the connection structure includes: forming a first insulating layer on a base substrate forming a mask layer having a first opening on a side of the first insulating layer away from the base substrate; forming a second insulating layer op a side of the mask layer away-from the first insulating layer; forming a second opening exposing the first opening in the second insulating layer by one patterning process, and forming a third opening in the first insulating layer.
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