Invention Grant
- Patent Title: Connection structure and fabrication method thereof, array substrate and fabrication method thereof
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Application No.: US16638196Application Date: 2019-05-29
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Publication No.: US11348952B2Publication Date: 2022-05-31
- Inventor: Zhen Zhang , Pengyu Liao
- Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Chengdu; CN Beijing
- Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Chengdu; CN Beijing
- Agency: Dilworth & Barrese, LLP.
- Agent Michael J. Musella, Esq.
- Priority: CN201810554032.4 20180531
- International Application: PCT/CN2019/089096 WO 20190529
- International Announcement: WO2019/228421 WO 20191205
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/31 ; G06F1/16 ; H01L27/32 ; H01L21/311 ; H01L51/00

Abstract:
Embodiments of the present provide a connection structure and a manufacturing thereof, an array substrate and a manufacturing method thereof, the manufacturing method of the connection structure includes: forming a first insulating layer on a base substrate forming a mask layer having a first opening on a side of the first insulating layer away from the base substrate; forming a second insulating layer op a side of the mask layer away-from the first insulating layer; forming a second opening exposing the first opening in the second insulating layer by one patterning process, and forming a third opening in the first insulating layer.
Information query
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