Invention Grant
- Patent Title: Curable semiconducting composition
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Application No.: US16466747Application Date: 2017-12-14
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Publication No.: US11355261B2Publication Date: 2022-06-07
- Inventor: Yichi Zhang , Timothy J. Person , Shrikant Dhodapkar , Remi A. Trottier
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2017/066247 WO 20171214
- International Announcement: WO2018/118603 WO 20180628
- Main IPC: H01B3/44
- IPC: H01B3/44 ; C08L23/08 ; C09D5/24 ; C09D123/08 ; H01B1/20 ; H01B3/34 ; H01B3/46

Abstract:
A rubberless, strippable, semiconducting composition that includes an ethylene-(carboxylic ester) copolymer having a low comonomeric unit content, carbon black, and a strippability additive combination comprising an amide wax and a silicone oil. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.
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