Invention Grant
- Patent Title: Substrate treatment device and substrate treatment method
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Application No.: US16916288Application Date: 2020-06-30
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Publication No.: US11355337B2Publication Date: 2022-06-07
- Inventor: Masaya Kamiya , Kensuke Demura , Daisuke Matsushima , Haruka Nakano , Ivan Petrov Ganachev
- Applicant: Shibaura Mechatronics Corporation
- Applicant Address: JP Yokohama
- Assignee: Shibaura Mechatronics Corporation
- Current Assignee: Shibaura Mechatronics Corporation
- Current Assignee Address: JP Yokohama
- Agency: Pearne & Gordon LLP
- Priority: JP2016-156786 20160809
- Main IPC: H01L21/02
- IPC: H01L21/02 ; G03F7/40 ; G03F7/42 ; B08B3/10 ; B08B7/00 ; H01L21/67 ; H01L21/687 ; H01L21/66
Abstract:
A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.
Public/Granted literature
- US20200335324A1 SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD Public/Granted day:2020-10-22
Information query
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