Invention Grant
- Patent Title: Transfer apparatus of an electronic component
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Application No.: US16761905Application Date: 2018-12-03
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Publication No.: US11355365B2Publication Date: 2022-06-07
- Inventor: Changjoon Lee , Byunghoon Lee , Min Park , Kyungwoon Jang , Jeonggen Yoon , Hyuntae Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR10-2017-0164096 20171201,KR10-2017-0164103 20171201,KR10-2018-0069255 20180615
- International Application: PCT/KR2018/015198 WO 20181203
- International Announcement: WO2019/108045 WO 20190606
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B65G47/90 ; H01L25/075

Abstract:
Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
Public/Granted literature
- US20200321229A1 TRANSFER APPARATUS OF AN ELECTRONIC COMPONENT Public/Granted day:2020-10-08
Information query
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