- Patent Title: Static random access memory cell and manufacturing method thereof
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Application No.: US16927751Application Date: 2020-07-13
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Publication No.: US11355500B2Publication Date: 2022-06-07
- Inventor: Yi-Jing Lee , Tsz-Mei Kwok , Ming-Hua Yu , Kun-Mu Li
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/02 ; H01L29/78 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/08 ; H01L29/165

Abstract:
A static random access memory (SRAM) cell includes a semiconductor fin, a first gate structure, a second gate structure, an epitaxy structure, and a first fin sidewall structure. The first gate structure crosses the semiconductor fin to form a pull-down (PD) transistor. The second gate structure crosses the semiconductor fin to form a pull-gate (PG) transistor. The epitaxy structure is on the semiconductor fin and between the first and second gate structures. The first fin sidewall structure is on a first side of the epitaxy structure and between the first and second gate structures. A method for manufacturing the semiconductor device is also disclosed.
Public/Granted literature
- US20200343250A1 STATIC RANDOM ACCESS MEMORY CELL AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-10-29
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