Invention Grant
- Patent Title: High density bezel for patch panel
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Application No.: US16624432Application Date: 2018-06-19
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Publication No.: US11356751B2Publication Date: 2022-06-07
- Inventor: Gordon John White , Shawn Phillip Tobey , Brian J. Fitzpatrick
- Applicant: COMMSCOPE TECHNOLOGIES LLC
- Applicant Address: US NC Hickory
- Assignee: COMMSCOPE TECHNOLOGIES LLC
- Current Assignee: COMMSCOPE TECHNOLOGIES LLC
- Current Assignee Address: US NC Hickory
- Agency: Merchant & Gould P.C.
- International Application: PCT/US2018/038295 WO 20180619
- International Announcement: WO2018/236875 WO 20181227
- Main IPC: H04Q1/02
- IPC: H04Q1/02 ; H01R13/42 ; H01R13/518 ; H01R13/10

Abstract:
A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).
Information query