Invention Grant
- Patent Title: RF package module and electronic device comprising RF package module
-
Application No.: US16756593Application Date: 2017-12-06
-
Publication No.: US11357099B2Publication Date: 2022-06-07
- Inventor: Kwang-Hyun Baek , Sangwook Park , Dong Gun Kam , Young-ju Lee
- Applicant: Samsung Electronics Co., Ltd. , Ajou University Industry-Academic Cooperation Foundation
- Applicant Address: KR Suwon-si; KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.,Ajou University Industry-Academic Cooperation Foundation
- Current Assignee: Samsung Electronics Co., Ltd.,Ajou University Industry-Academic Cooperation Foundation
- Current Assignee Address: KR Suwon-si; KR Suwon-si
- Priority: KR10-2017-0135243 20171018
- International Application: PCT/KR2017/014237 WO 20171206
- International Announcement: WO2019/078408 WO 20190425
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H01Q1/48 ; H01Q9/04 ; H01L23/498 ; H01L23/66 ; H01Q1/22 ; H04B1/40

Abstract:
The disclosure relates to research (No. GK17N0100, millimeter wave 5G mobile communication system development) that was conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017.
An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided.
The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.
An Radio Frequency (RF) package module according to various embodiments and an electronic device including the RF package module are provided.
The RF package module according to an embodiment includes a sub module including an Radio Frequency Integrated Chip (RFIC); an antenna configured to transmit and receive a signal wirelessly through a predetermined metal pattern; and a multi-layer circuit board including a plurality of layers in which a signal via for transferring the signal between the RFIC and the antenna and one or more ground vias are formed, wherein the antenna is spaced from the one or more ground vias by one or more anti-pads.
Public/Granted literature
- US20200245450A1 RF PACKAGE MODULE AND ELECTRONIC DEVICE COMPRISING RF PACKAGE MODULE Public/Granted day:2020-07-30
Information query