- 专利标题： Batch substrate support with warped substrate capability
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申请号： US16198417申请日： 2018-11-21
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公开(公告)号： US11361981B2公开(公告)日： 2022-06-14
- 发明人: Shashidhara Patel , Ananthkrishna Jupudi , Ribhu Gautam
- 申请人： APPLIED MATERIALS, INC.
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Moser Taboada
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; C23C16/458 ; H01L21/68 ; H01L21/673
摘要：
Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.
公开/授权文献
- US20190341286A1 BATCH SUBSTRATE SUPPORT WITH WARPED SUBSTRATE CAPABILITY 公开/授权日：2019-11-07
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