公开(公告)号：US11361981B2

公开(公告)日：2022-06-14

申请号：US16198417

申请日：2018-11-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Shashidhara Patel ,  Ananthkrishna Jupudi ,  Ribhu Gautam

IPC: H01L21/677 ,  C23C16/458 ,  H01L21/68 ,  H01L21/673

Abstract: Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.

公开(公告)号：US11784075B2

公开(公告)日：2023-10-10

申请号：US17227442

申请日：2021-04-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Shashidhara Patel ,  Ananthkrishna Jupudi ,  Ribhu Gautam

IPC: H01L21/67 ,  H01L21/677 ,  C23C16/458 ,  H01L21/68 ,  H01L21/673

CPC classification number: H01L21/67757 ,  C23C16/4583 ,  H01L21/67346 ,  H01L21/68

Abstract: Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.

公开(公告)号：US20210233790A1

公开(公告)日：2021-07-29

申请号：US17227442

申请日：2021-04-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Shashidhara Patel ,  Ananthkrishna Jupudi ,  Ribhu Gautam

IPC: H01L21/677 ,  C23C16/458 ,  H01L21/68 ,  H01L21/673

Abstract: Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.

公开(公告)号：US20190341286A1

公开(公告)日：2019-11-07

申请号：US16198417

申请日：2018-11-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Shashidhara Patel ,  Ananthkrishna Jupudi ,  Ribhu Gautam

IPC: H01L21/677 ,  H01L21/673 ,  H01L21/68 ,  C23C16/458

Abstract: Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.