Invention Grant
- Patent Title: Integrated power amplifier
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Application No.: US16600604Application Date: 2019-10-14
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Publication No.: US11362109B2Publication Date: 2022-06-14
- Inventor: Ko-Tao Lee , Xin Zhang , Todd Edward Takken
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Stephen R. Yoder
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84 ; H01L21/762 ; H01L29/78 ; H01L29/20 ; H01L21/02 ; H01L29/66

Abstract:
The semiconductor structure includes a semiconductor-on-insulator (SOI) substrate. A group III nitride transistor is formed in a trench in the SOI substrate. The activation of the group III nitride transistor is controlled by a silicon-based transistor. The silicon-based transistor that includes a portion of a silicon layer of the SOI substrate. A group III nitride transistor device is adjacent to the silicon-based transistor.
Public/Granted literature
- US20210111192A1 INTEGRATED POWER AMPLIFIER Public/Granted day:2021-04-15
Information query
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