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公开(公告)号：US12183999B2
公开(公告)日：2024-12-31
申请号：US17555346
申请日：2021-12-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Xin Zhang , Todd Edward Takken , Yuan Yao , Andrew Ferencz
Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.
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公开(公告)号：US20240394508A1
公开(公告)日：2024-11-28
申请号：US18323364
申请日：2023-05-24
Inventor： Shun Zhang , Xin Zhang , Shaoze Fan , Jing Li , Ningyuan Cao , Xiaoxiao Guo , Chuang Gan
IPC: G06N3/0442 , G06N3/084
Abstract: A computing device includes a processor and a storage device coupled to the processor. The storage device stores instructions to cause the processor to perform acts to provide a circuit performance modeling. The acts include identifying and extracting paths of an electric circuit between a plurality of designated components that represent the electric circuit; converting at least one of the extracted paths to a path embedding comprising a vector of a fixed length; and predicting, by a circuit representation-learning model, characteristics of the designated components that represent the electric circuit based on an input of circuit parameters of the electric circuit.
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公开(公告)号：US20240037940A1
公开(公告)日：2024-02-01
申请号：US17875566
申请日：2022-07-28
Applicant: International Business Machines Corporation
Inventor： Bo Wu , Chuang Gan , Pin-Yu Chen , Yang Zhang , Xin Zhang
IPC: G06V20/40
Abstract: A computer vision temporal action localization (TAL) computing tool and operations are provided. The TAL computing tool receives a coarse temporal bounding box, having a first start point and a first end point, for an action in the input video data, and a first set of logits, where each logit corresponds to a potential classification of the action in the input video data. The TAL computing tool executes a first engine on the coarse temporal bounding box to generate a second set of logits, and a second engine on the first set of logits to generate a refined temporal bounding box having a second start point and a second end point. The TAL computing tool performs the computer vision temporal action localization operation based on the second set of logits and the refined temporal bounding box to specify a temporal segment of the input video data corresponding to an action represented in the input video data, and a corresponding classification of the action represented in the temporal segment.
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公开(公告)号：US11799374B2
公开(公告)日：2023-10-24
申请号：US17476586
申请日：2021-09-16
Applicant: International Business Machines Corporation
Inventor： Xin Zhang , Todd Edward Takken , Yuan Yao
CPC classification number: H02M3/003 , H05K1/181 , H05K3/303 , H05K2201/10325 , H05K2201/10719
Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.
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公开(公告)号：US20230198177A1
公开(公告)日：2023-06-22
申请号：US17555346
申请日：2021-12-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Xin Zhang , Todd Edward Takken , Yuan Yao , Andrew Ferencz
CPC classification number: H01R12/62 , H05K1/111 , H05K3/321 , H05K2201/10356 , H05K2201/10984
Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.
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Patent Agency Ranking
公开(公告)号：US20220139709A1
公开(公告)日：2022-05-05
申请号：US17089915
申请日：2020-11-05
Applicant: International Business Machines Corporation
Inventor： Ko-Tao Lee , Shawn Xiaofeng Du , Ning Li , Xin Zhang
IPC: H01L21/02 , H01L21/306 , H01L29/66 , H01L29/20 , H01L29/205 , H01L29/778 , C30B29/40 , C30B29/06 , C30B33/08 , C30B25/18 , C30B23/02
Abstract: A method of manufacturing an electronic device is provided. The method includes forming a dielectric layer on a Si-based substrate, etching away portions of the dielectric layer to form a crisscrossing grid pattern of remaining portions of the dielectric layer and to expose the substrate in areas where the dielectric layer is removed, forming GaN-based layers on the substrate in growth areas between sidewalls of the remaining portions of the dielectric layer, and forming a semiconductor device on the GaN-based layers.
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公开(公告)号：US11311224B2
公开(公告)日：2022-04-26
申请号：US16738040
申请日：2020-01-09
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Qianwen Chen , Huan Hu , Zheng Xu , Xin Zhang
Abstract: A method is presented for forming a nanowire electrode. The method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming solder bumps and electrical interconnections over a second flexible substrate, and integrating nanowire electrode arrays to the second flexible substrate. The plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject to achieve electrical biopotential signals. The plurality of nanowires are formed over the first substrate by metal-assisted chemical etching.
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公开(公告)号：US11164335B2
公开(公告)日：2021-11-02
申请号：US16181744
申请日：2018-11-06
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Xin Zhang , Peng Gao , Zhi Hu Wang , Ning Duan , Gang BJ Ning , Yan Fang
Abstract: A computer-implemented method is presented for inferring passenger routes in a subway system. The method includes identifying, via an imaging device, a target passenger within the subway system, employing an exiting flow extractor to determine passenger exiting waves, employing an exiting wave identifier to mark an exiting wave of the passenger exiting waves including the target passenger, employing a supporting evidence backtracer to determine an entrance gate for each of the passengers in the marked exiting wave including the target passenger, determining a route probability for each of the passengers in the marked exiting wave including the target passenger via voting or distribution estimation processing, and employing a most probable route inferer to infer a route of the target passenger based on an aggregate route probability for all the passengers in the marked exiting wave.
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公开(公告)号：US11150712B2
公开(公告)日：2021-10-19
申请号：US16399981
申请日：2019-04-30
Applicant: International Business Machines Corporation
Inventor： Xin Zhang , Todd E. Takken , Andrew Ferencz , Leland Chang , Paul W. Coteus
Abstract: Voltage on the output terminal of an inductor is obtained as a first input signal to a control block (CB); the inductor has an input terminal connected to a power switch and driver block at a switching node. A sense input voltage is obtained on an output terminal of a sensing circuit that is not directly connected to the switching node, as a second input signal to the CB. A voltage is generated on a first output terminal of the CB and is selected such that the CB can use its first and second input signals to infer the current through the inductor. A pulse width modulation (PWM) signal is generated on a second output terminal of the CB, based on the inferred current through the inductor; the second output signal from the CB is provided to a PWM input terminal of the power switch and driver block.
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公开(公告)号：US11114944B2
公开(公告)日：2021-09-07
申请号：US16707186
申请日：2019-12-09
Applicant: International Business Machines Corporation
Inventor： Xin Zhang , Todd E. Takken , Naigang Wang , Leland Chang
IPC: H02M3/158
Abstract: A multi-phase buck switching converter having grouped pairs of phases, each phase using two magnetically coupled air-core inductors. For each group, a first driver circuit controlling switching of a first power transistor switching circuit coupled to a first air-core inductor output for driving an output load at the first phase. A second driver circuit controlling switching of a second power transistor switching circuit coupled to a second air-core inductor output for driving said output load at the second phase. The first and second phases are spaced 180° apart. The coupled air-core inductors per group of such orientation, separation distance and mutual inductance polarity relative to each other such that magnetic coupling between the two or more inductors at each phase results in a net increase in effective inductance per unit volume. Each air-core inductor is a metal slab of defined length, height and thickness formed using back-end-of-line semiconductor manufacturing process.
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