Invention Grant
- Patent Title: Epitaxial semiconductor material regions for transistor devices and methods of forming same
-
Application No.: US16774157Application Date: 2020-01-28
-
Publication No.: US11362177B2Publication Date: 2022-06-14
- Inventor: Arkadiusz Malinowski , Baofu Zhu , Frank W. Mont , Ali Razavieh , Julien Frougier
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/78

Abstract:
One illustrative transistor of a first dopant type disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. The device also includes a counter-doped epitaxial semiconductor material positioned proximate a bottom of each of the first and second overall epitaxial cavities, wherein the counter-doped epitaxial semiconductor material is doped with a second dopant type that is opposite to the first dopant type, and a same-doped epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities above the counter-doped epitaxial semiconductor material, wherein the same-doped epitaxial semiconductor material is doped with a dopant of the first dopant type.
Public/Granted literature
- US20210233999A1 NOVEL EPITAXIAL SEMICONDUCTOR MATERIAL REGIONS FOR TRANSISTOR DEVICES AND METHODS OF FORMING SAME Public/Granted day:2021-07-29
Information query
IPC分类: