Invention Grant
- Patent Title: Semiconductor device and method for making the same
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Application No.: US16415136Application Date: 2019-05-17
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Publication No.: US11362191B2Publication Date: 2022-06-14
- Inventor: Chi-Yi Chuang , Ching-Wei Tsai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner L.L.P
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L27/092 ; H01L29/78 ; H01L29/66

Abstract:
The present disclosure relates to a hybrid integrated circuit. In one implementation, an integrated circuit may have a first region with a first gate structure having a ferroelectric gate dielectric, at least one source associated with the first gate of the first region, and at least one drain associated with the first gate structure of the first region. Moreover, the integrated circuit may have a second region with a second gate structure having a high-κ gate dielectric, at least one source associated with the second gate structure of the second region, and at least one drain associated with the second gate structure of the second region. The integrated circuit may further have at least one trench isolation between the first region and the second region.
Information query
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