Invention Grant
- Patent Title: Printed circuit board including electroconductive pattern and electronic device including printed circuit board
-
Application No.: US16200401Application Date: 2018-11-26
-
Publication No.: US11363711B2Publication Date: 2022-06-14
- Inventor: Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KRKR10-2017-0160993 20171128
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q1/38 ; H05K1/02 ; H01Q15/00 ; H01Q21/28 ; H01Q9/04 ; H01Q21/00 ; H01Q21/08

Abstract:
According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
Public/Granted literature
Information query