Invention Grant
- Patent Title: Laser machining apparatus that irradiates guide beam to project guide pattern indicating setup position for workpiece
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Application No.: US16016114Application Date: 2018-06-22
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Publication No.: US11364567B2Publication Date: 2022-06-21
- Inventor: Yasuo Nishikawa , Koki Furukawa
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: K&L Gates LLP
- Priority: JPJP2015-251987 20151224
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/082 ; B23K26/70 ; B23K26/03 ; B23K26/364 ; G02B26/10

Abstract:
A laser machining apparatus includes: a laser beam emission device; a guide beam emission device; a scanner; a processor; and a memory. The memory stores a set of computer-readable instructions therein. The set of computer-readable instructions, when executed by the processor, causes the laser machining apparatus to perform: acquiring workpiece contour information specifying a contour of the workpiece; extracting a plurality of feature points from the workpiece contour information, each of the plurality of feature points being on the contour of the workpiece; generating a guide pattern indicating a setup position of the workpiece according to the plurality of feature points; and drawing the guide pattern with the guide beam by controlling the guide beam emission device and the scanner.
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