Invention Grant
- Patent Title: SRAM structure and method
-
Application No.: US16942278Application Date: 2020-07-29
-
Publication No.: US11367479B2Publication Date: 2022-06-21
- Inventor: Chih-Chuan Yang , Shih-Hao Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C11/412 ; H01L21/475 ; H01L27/11 ; G11C11/419

Abstract:
Semiconductor devices and methods are provided. A semiconductor device of the present disclosure includes a bias source, a memory cell array including a first region adjacent to the bias source and a second region away from the bias source, and a conductive line electrically coupled to the bias source, a first memory cell in the first region and a second memory cell in the second region. The first memory cell is characterized by a first alpha ratio and the second memory cell is characterized by a second alpha ratio smaller than the first alpha ratio.
Public/Granted literature
- US20210098049A1 SRAM Structure and Method Public/Granted day:2021-04-01
Information query