- 专利标题： Electronic device comprising metal case having metal pad attached thereto
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申请号： US16324322申请日： 2017-08-23
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公开(公告)号： US11374306B2公开(公告)日： 2022-06-28
- 发明人: Ja-myeong Koo , Jeong-gen Yoon , Young-chul Lee , Myeong-hwa Kim , Tae-hyeong Kim , Yeon-kwan Moon , Min-goo Seo , Seung-yup Lee
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Jefferson IP Law, LLP
- 优先权： KR10-2016-0111045 20160830
- 国际申请： PCT/KR2017/009225 WO 20170823
- 国际公布： WO2018/043986 WO 20180308
- 主分类号： H01Q1/24
- IPC分类号： H01Q1/24 ; H05K5/04 ; H01R13/24 ; H01R43/02 ; H01R12/70
摘要：
An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.
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