- Patent Title: Method for increasing EAM bandwidth, component structure and manufacturing process thereof using plural p-i-n waveguides serially connected by high-impedance transmission lines
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Application No.: US16903159Application Date: 2020-06-16
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Publication No.: US11374382B2Publication Date: 2022-06-28
- Inventor: Fang-Jeng Lin , Yu-Chun Fan , Pi-Cheng Law , Yi-Ching Chiu
- Applicant: LuxNet Corporation
- Applicant Address: TW Taoyuan
- Assignee: LuxNet Corporation
- Current Assignee: LuxNet Corporation
- Current Assignee Address: TW Taoyuan
- Agency: WPAT, PC
- Priority: TW109109657 20200323
- Main IPC: H01S5/026
- IPC: H01S5/026 ; H01S5/06 ; H01S5/20 ; H01S5/028 ; G02F1/015 ; G02F1/01 ; G02F1/025

Abstract:
A method for increasing the bandwidth of an electroabsorption modulator (EAM) includes the following steps. First, a plurality of p-i-n active waveguides for the EAM are defined on a p-i-n optical waveguide forming an EAM having a shorter p-i-n active waveguide length. Then, the bandwidth of the EAM can be increased. Second, the high-impedance transmission lines are used in series to connect the EAM sections to reduce the microwave reflection and then increase the device bandwidth. Finally, the impedance-controlled transmission lines for the signal input and output can not only reduce the parasitic effects resulting from packaging, but also reduce the microwave reflection resulting from the impedance mismatch at the device input and load.
Public/Granted literature
- US20210296850A1 METHOD FOR INCREASING EAM BANDWIDTH, COMPONENT STRUCTURE AND MANUFACTURING PROCESS THEREOF Public/Granted day:2021-09-23
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