Invention Grant
- Patent Title: Optical measurement equipment and method for measuring warpage of a workpiece
-
Application No.: US16285000Application Date: 2019-02-25
-
Publication No.: US11375124B2Publication Date: 2022-06-28
- Inventor: Ming-Han Wang , Ian Hu , Meng-Kai Shih , Hsuan Yu Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N5/247 ; G06T7/00 ; H04N5/225
Abstract:
An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.
Public/Granted literature
- US20200275030A1 OPTICAL MEASUREMENT EQUIPMENT AND METHOD FOR MEASURING WARPAGE OF A WORKPIECE Public/Granted day:2020-08-27
Information query
