Invention Grant
- Patent Title: Latency reduction
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Application No.: US16990982Application Date: 2020-08-11
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Publication No.: US11375574B2Publication Date: 2022-06-28
- Inventor: Dishant Srivastava , Benjamin Campbell , Joel Linsky , Mayank Batra
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H04W76/40
- IPC: H04W76/40 ; H04W76/15 ; H04L1/00 ; H04R5/04 ; H04W76/19

Abstract:
Reduced Advanced Audio Distribution Profile (A2DP) latency on a link between a source and a pair of headphones may be achieved by improving the quality of the link between secondary and primary and establishing a direct link between the source and secondary to mitigate the link quality issues of the source and primary link. In one example, this involves receiving, via a first receiver, packets from a source on a first wireless connection, determining, by the first receiver, that a first packet received via the first wireless connection has an error, establishing a second connection between the first receiver and a second receiver, and establishing a third connection between the second receiver and the source. In particular, the first receiver may be configured as a primary True Wireless Stereo (TWS) Bluetooth device and the second receiver may be configured as a secondary TWS Bluetooth device.
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