Invention Grant
- Patent Title: Socket for electrical component
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Application No.: US16958041Application Date: 2018-12-13
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Publication No.: US11381047B2Publication Date: 2022-07-05
- Inventor: Osamu Hachuda
- Applicant: ENPLAS CORPORATION
- Applicant Address: JP Kawaguchi
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Kawaguchi
- Agency: Staas & Halsey LLP
- Priority: JPJP2017-252364 20171227
- International Application: PCT/JP2018/045849 WO 20181213
- International Announcement: WO2019/131171 WO 20190704
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R33/97 ; G01R1/04 ; H01L23/32 ; H01R33/74

Abstract:
To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.
Public/Granted literature
- US20210066871A1 Socket for Electrical Component Public/Granted day:2021-03-04
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