Invention Grant
- Patent Title: Below-grade modular assembly
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Application No.: US16572048Application Date: 2019-09-16
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Publication No.: US11384524B2Publication Date: 2022-07-12
- Inventor: Frank Pospisil , Breton Betz
- Applicant: United States Gypsum Company
- Applicant Address: US IL Chicago
- Assignee: United States Gypsum Company
- Current Assignee: United States Gypsum Company
- Current Assignee Address: US IL Chicago
- Agency: Greer, Burns & Crain, Ltd.
- Agent Philip T. Petti; Pradip Sahu
- Main IPC: E04B1/00
- IPC: E04B1/00 ; E02D27/32 ; E04B1/348
Abstract:
A modular assembly is provided and includes a modular frame to be installed at least partially below grade and at least two panels attached to the modular frame, where the at least two panels are made of a material that withstands lateral, vertical and shear forces generated by surrounding below grade materials. The modular frame and the at least two panels are joined together as a unit prior to installation.
Information query
