Invention Grant
- Patent Title: Multilayer electronic component
-
Application No.: US16854216Application Date: 2020-04-21
-
Publication No.: US11387041B2Publication Date: 2022-07-12
- Inventor: Jae Sun Won , Jong Duck Kim , Hae Suk Chung , Jae Joon Yu , Won Woo Cho , Ki Hong Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0172195 20191220
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/30 ; H01G4/40 ; H01G4/232 ; H01G4/248

Abstract:
By controlling shapes of internal electrodes, when short-circuit occurs between the internal electrodes, a short-circuited portion may be opened by an overcurrent, to serve as a fuse. Also, by controlling shapes of internal electrodes, equivalent series inductance (ESL) at a high frequency may be reduced.
Public/Granted literature
- US20210193385A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2021-06-24
Information query