Invention Grant
- Patent Title: Memory device and method for fabricating the same
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Application No.: US17134131Application Date: 2020-12-24
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Publication No.: US11387337B2Publication Date: 2022-07-12
- Inventor: Chun-Sung Huang , Shen-De Wang , Chia-Ching Hsu , Wang Xiang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/40 ; H01L29/792

Abstract:
A memory device includes a main cell on a substrate, a first reference cell adjacent to one side of the main cell, and a second reference cell adjacent to another side of the main cell. Preferably, the main cell includes a first gate electrode on the substrate, a second gate electrode on one side of the first gate electrode and covering a top surface of the first gate electrode, a first charge trapping layer between the first gate electrode and the second gate electrode and including a first oxide-nitride-oxide (ONO) layer, a third gate electrode on another side of the first gate electrode and covering the top surface of the first gate electrode, and a second charge trapping layer between the first gate electrode and the third gate electrode and including a second ONO layer.
Public/Granted literature
- US20210119004A1 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-04-22
Information query
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